Our WWS line of metal bond crystalline diamond products are widely used in resin bond, metal bond, vitreous bond and electroplated bond systems.
Uniform shape and size control, along with consistent fracturing
modes for each respective product make our WWS line of products ideal for a variety of glass grinding applications, grinding tungsten carbide, fiberglass and other composite materials.
- Resin Bond
- Vitrified Bond
- Metal Bond
- Single Layer Bond
WWS-200
Blocky Shape
Density 3.52 g/cm3
A medium quality, semi-crystalline blocky shaped crystal with good toughness and thermal stability. Increased friability vs. the WWS-300 and an improved surface texture on the WWS-200’s crystal facets produce a free cutting crystal that regenerates new cutting edges with moderate grinding force.
- Vitrified Bond
- Metal Bond
- Single Layer Bond
WWS-300
Cubo-Octahedral
Shape Density 3.52 g/cm3
High quality cubo-octahedral diamond that is thermally stable, requires high grinding forces to generate new cutting edges and fractures in a controlled manner. Uniform shape, along with the WWS-300’s free cutting capability.
- Metal Bond
- Single Layer Bond
WWS-400
Cubo-Octahedral
Shape Density 3.52 g/cm3
Excellent cubo-octahedral crystal shape, high impact strength and very high thermal stability make the WWS-400 suitable for demanding applications where high production rates are desired.
- Metal Bond
- Single Layer Bond
WWS-500
Cubo-Octahedral
Shape Density 3. g/cm3
Uniform shaped cubo-octahedral crystals that exhibit very high toughness and exceptional thermal stability along with minimal internal impurities.
Resin Bond
systems are widely used for all-purpose superabrasive grinding applications in either phenolic or polyimide bonds. Resin bond systems can be utilized in either wet or dry grinding operations and offer excellent particle retention and part finish.
Vitrified Bond
systems are manufactured from ceramic materials that are strong, durable and brittle. Vitrified bonds are very effective in advanced grinding operations because of their ability to hold the abrasive and reduce heat generation in the grinding zone due to their high porosity levels when compared to other bond types.
Single Layer Bond
systems (electroplated and brazed) hold a single layer of superabrasive grains bonded to a precision machined form. Electroplated systems are bonded with a Nickel matrix and leave approximately 50% of the abrasive exposed while brazed systems leave approximately 80% of the abrasive exposed. Single layer bond systems typically do not require dressing.
US Mesh (FEPA) | 60/80 (D252) | 80/100 (D181) | 100/120 (D151) | 120/140 (D126) | 140/170 (D107) | 170/200 (D91) | 200/230 (D76) | 230/270 (D64) | 270/325 (D54) | 325/400 (D46) | 400/500 (D32) |
WWS-200 | |||||||||||
WWS-300 | |||||||||||
WWS-400 | |||||||||||
WWS-500 |