Our line of metal bond non-crystalline products are recommended for resin bond, vitrified bond, metal bond and electroplated bond systems where a more free cutting crystal is required.
These products require less force per grit to regenerate new cutting edges vs. our WWS-200, thus providing a free cutting material that requires less power when grinding.
Recommended for glass grinding, PCD/PCBN grinding and lapping, resin bond stone polishing tools and dental burrs.
- Resin Bond
- Vitrified Bond
- Single Layer Bond
MB-100
Angular Shape
Density 3.52 g/cm3
Friable, angular shaped crystal that rapidly regenerates new cutting edges with low grinding forces. Rough surface texture provides increased mechanical retention in most resin bond systems.
- Resin Bond
- Vitrified Bond
- Single Layer Bond
MB-150
Semi Blocky Shape
Density 3.52 g/cm3
Semi-blocky shaped crystal that is recommended where the optimal balance of free cutting action and extended tool life is desired. The MB- 150’s ability to continuously regenerate new cutting edges and high impact resistance make it an excellent choice when grinding difficult materials.
- Resin Bond
- Metal Bond
- Single Layer Bond
MB-200
Blocky Shape
Density 3.52 g/cm3
Uniform, blocky shaped crystal that requires the most force per grit to generate new cutting edges. The MB- 200 provides long tool life where high material rates are desired.
Resin Bond
systems are widely used for all-purpose superabrasive grinding applications in either phenolic or polyimide bonds. Resin bond systems can be utilized in either wet or dry grinding operations and offer excellent particle retention and part finish.
Vitrified Bond
systems are manufactured from ceramic materials that are strong, durable and brittle. Vitrified bonds are very effective in advanced grinding operations because of their ability to hold the abrasive and reduce heat generation in the grinding zone due to their high porosity levels when compared to other bond types.
Single Layer Bond
systems (electroplated and brazed) hold a single layer of superabrasive grains bonded to a precision machined form. Electroplated systems are bonded with a Nickel matrix and leave approximately 50% of the abrasive exposed while brazed systems leave approximately 80% of the abrasive exposed. Single layer bond systems typically do not require dressing.
US Mesh (FEPA) | 30/35 (D601) | 35/40 (D501) | 40/45 (D426) | 45/50 (D356) | 50/60 (D301) | 60/80 (D252) | 80/100 (D181) | 100/120 (D151) | 120/140 (D126) | 140/170 (D107) | 170/200 (D91) | 200/230 (D76) | 230/270 (D64) | 270/325 (D54) | 325/400 (D46) | 400/500 (D32) |
MB-100 | ||||||||||||||||
MB-100 N30 | ||||||||||||||||
MB-100 N56 | ||||||||||||||||
MB-100 C50 | ||||||||||||||||
MB-150 | ||||||||||||||||
MB-150 N30 | ||||||||||||||||
MB-150 N56 | ||||||||||||||||
MB-150 C50 | ||||||||||||||||
MB-200 | ||||||||||||||||
MB-200 N56 | ||||||||||||||||
MB-200 C50 |